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HVL355CM
Variable Capacitance Diode for VCO
REJ03G0012-0200Z Rev.2.00 Jun.07.2004
Features
* High capacitance ratio. (n = 2.35 min) * Low series resistance. (rs = 0.60 max) * Thin Extremely small Flat Package (TEFP) is suitable for surface mount design.
Ordering Information
Type No. HVL355CM Laser Mark B Package Code TEFP
Pin Arrangement
Cathode mark Mark 1
*
B
2 1. Cathode 2. Anode
Rev.2.00 Jun 07, 2004 page 1 of 4
HVL355CM
Absolute Maximum Ratings
(Ta = 25C)
Item Reverse voltage Junction temperature Storage temperature Symbol VR Tj Tstg Value 15 125 -55 to +125 Unit V C C
Electrical Characteristics
(Ta = 25C)
Item Reverse current Capacitance Capacitance ratio Series resistance Symbol IR1 IR2 C1 C4 n rS Min 6.62 2.60 2.35 Typ Max 10 100 7.02 2.95 2.55 0.60 Unit nA pF -- Test Condition VR = 15 V VR = 15 V, Ta = 60C VR = 1 V, f = 1 MHz VR = 4 V, f = 1 MHz C1 / C4 VR = 1 V, f = 470 MHz
Notes: 1. Please do not use the soldering iron due to avoid high stress to the TEFP package. 2. The material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned. Please kindly consider soldering nature.
Rev.2.00 Jun 07, 2004 page 2 of 4
HVL355CM
Main Characteristic
10-6 10
Reverse current IR (A)
-7
12 f = 1MHz 10
Capacitance C (pF)
10-8 10-9 10
-10
8
6
Ta = 75C
10-11 10-12 10-13
Ta = 25C
4
2
0
4
8
12
16
20
0 0.1
1.0 Reverse voltage VR (V)
10
Reverse voltage VR (V) Fig.1 Reverse current vs. Reverse voltage
Fig.2 Capacitance vs. Reverse voltage
0.6 f = 470MHz 0.5
Series resistance rS () LF = (LogC)/(LogVR)
0
0.4
-0.5
0.3
0.2
-1.0
0.1
0 0.1
1.0 Reverse voltage VR (V)
10
-1.5 0.1
1.0 Reverse voltage VR (V) Fig.4 LF vs. Reverse voltage
10
Fig.3 Series resistance vs. Reverse voltage
Rev.2.00 Jun 07, 2004 page 3 of 4
HVL355CM
Package Dimensions
As of January, 2003
Unit: mm
0.8
+ 0.10 - 0.05
1.0 0.05
0.13 0.05
0.4 Max
0.3 0.05 0.6 0.05
Package Code JEDEC JEITA Mass (reference value)
TEFP -- -- 0.0006 g
Rev.2.00 Jun 07, 2004 page 4 of 4
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